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Donโ€™t Fear the Small โ€“ Embrace it!

2024-12-12

๐Ÿš€ Donโ€™t Fear the Small โ€“ ๐—˜๐—บ๐—ฏ๐—ฟ๐—ฎ๐—ฐ๐—ฒ ๐— ๐—ถ๐—ป๐—ถ๐—ฎ๐˜๐˜‚๐—ฟ๐—ถ๐˜‡๐—ฎ๐˜๐—ถ๐—ผ๐—ป! ๐Ÿ› ๏ธ

 

At Miromico, we often hear: โ€œ๐˜ ๐˜ฐ๐˜ถ ๐˜ฎ๐˜ข๐˜ฌ๐˜ฆ ๐˜ต๐˜ฉ๐˜ฆ ๐˜ช๐˜ฎ๐˜ฑ๐˜ฐ๐˜ด๐˜ด๐˜ช๐˜ฃ๐˜ญ๐˜ฆ ๐˜ฑ๐˜ฐ๐˜ด๐˜ด๐˜ช๐˜ฃ๐˜ญ๐˜ฆ ๐˜ธ๐˜ฉ๐˜ฆ๐˜ฏ ๐˜ช๐˜ต ๐˜ค๐˜ฐ๐˜ฎ๐˜ฆ๐˜ด ๐˜ต๐˜ฐ ๐˜ฎ๐˜ช๐˜ฏ๐˜ช๐˜ข๐˜ต๐˜ถ๐˜ณ๐˜ช๐˜ป๐˜ข๐˜ต๐˜ช๐˜ฐ๐˜ฏ.โ€ Itโ€™s trueโ€”thinking small unlocks big opportunities for IoT innovation. But how do you achieve effective miniaturization?

 

Hereโ€™s our guide to making the most of every millimeter:

 

1๏ธโƒฃ ๐—œ๐—ฑ๐—ฒ๐—ป๐˜๐—ถ๐—ณ๐˜† ๐—ฌ๐—ผ๐˜‚๐—ฟ ๐— ๐—ถ๐—ป๐—ถ๐—บ๐˜‚๐—บ ๐—ฆ๐—ถ๐˜‡๐—ฒ ๐—Ÿ๐—ถ๐—บ๐—ถ๐˜๐˜€:

Start with the physical constraintsโ€”antenna frequency, battery, or connector dimensions often dictate the smallest possible form factor.

 

2๏ธโƒฃ ๐—จ๐˜€๐—ฒ ๐˜๐—ต๐—ฒ ๐—ฆ๐—บ๐—ฎ๐—น๐—น๐—ฒ๐˜€๐˜ ๐—–๐—ผ๐—บ๐—ฝ๐—ผ๐—ป๐—ฒ๐—ป๐˜ ๐—ฃ๐—ฎ๐—ฐ๐—ธ๐—ฎ๐—ด๐—ฒ๐˜€:

Explore options like CSP (Chip Scale Packaging) or BGA (Ball Grid Array). Stacked modules can integrate multiple functions while saving precious space. Check with your manufacturer to confirm their assembly capabilities.

 

3๏ธโƒฃ ๐—ฃ๐—น๐—ฎ๐—ป ๐—ฅ๐—ฎ๐—ฝ๐—ถ๐—ฑ ๐—ฃ๐—–๐—• ๐—ฃ๐—น๐—ฎ๐—ฐ๐—ฒ๐—บ๐—ฒ๐—ป๐˜:

Sketch your desired PCB shape early. Use block diagrams to represent ICs or functional areas, including keep-out zones for critical components.

 

4๏ธโƒฃ ๐—Ÿ๐—ฒ๐˜ƒ๐—ฒ๐—ฟ๐—ฎ๐—ด๐—ฒ ๐— ๐—ผ๐—ฑ๐—ฒ๐—ฟ๐—ป ๐— ๐—ฎ๐—ป๐˜‚๐—ณ๐—ฎ๐—ฐ๐˜๐˜‚๐—ฟ๐—ถ๐—ป๐—ด ๐—ง๐—ฒ๐—ฐ๐—ต๐—ป๐—ถ๐—พ๐˜‚๐—ฒ๐˜€:

โ€ข HDI Designs: High-density interconnect PCBs allow for more compact layouts by using smaller vias and traces.

โ€ข Blind Vias in Pads: Save space and improve routing efficiency by integrating blind vias directly into component pads.

โ€ข Increase Layer Count: Adding layers improves routing, signal integrity, and ground planes.

โ€ข Printed Structures: Consider printing antennas or sensors onto enclosures using advanced substrate printing technologies.

 

5๏ธโƒฃ ๐—ข๐—ฝ๐˜๐—ถ๐—บ๐—ถ๐˜‡๐—ฒ ๐—ฆ๐—ถ๐—ด๐—ป๐—ฎ๐—น ๐—ฅ๐—ผ๐˜‚๐˜๐—ถ๐—ป๐—ด:

โ€ข Prioritize routing of critical signals first.

โ€ข Use x-y routing to maximize space and future adaptability.

 

6๏ธโƒฃ ๐—ง๐—ต๐—ถ๐—ป๐—ธ ๐—ถ๐—ป ๐—ง๐—ต๐—ฟ๐—ฒ๐—ฒ ๐——๐—ถ๐—บ๐—ฒ๐—ป๐˜€๐—ถ๐—ผ๐—ป๐˜€:

โ€ข Double-sided assemblies pack more functionality into less space.

โ€ข Stack exclusive or assembly variants directly on top of one another for maximum flexibility.

 

Miniaturization may seem challenging, but with the right techniques, it unlocks endless possibilities.

 

At Miromico, we specialize in transforming bold ideas into ultra-compact IoT solutions. When it comes to thinking small, we make it our mission to deliver BIG results. Need help? Contact our experts through rfi@miromico.ch.

 

Think IoT โ€“ Think Miromico!

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ยฉ 2025 Miromico AG
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